fix: enlarge case for selected ESP modules and wiring

hardware/README.md

@@ -1,7 +1,7 @@
 # RemoteRig — Camera Node Hardware Design
 
 > **Version:** 0.2.0 | **Status:** Draft  
-> **Target:** GoPro Hero 3 Black/Silver + ESP8266 + ESP32 + USB power bank
+> **Target:** GoPro Hero 3 Black/Silver + ESP-01S/ESP8266 + ESP32-C3 Super Mini + USB power bank
 
 ## Overview
 
@@ -29,8 +29,8 @@ Each camera node is two ESP boards in a small case that clips to the tripod/stan
 
 | Item | Qty | Cost | Notes |
 |------|-----|------|-------|
-| ESP32 Dev Board | 1 | ~$5 | MQTT bridge — talks to hub |
+| ESP32-C3 Super Mini | 1 | ~$5 | MQTT bridge — talks to hub; board footprint 22.5 × 18.0mm |
-| ESP8266 D1 Mini | 1 | ~$3 | Camera bridge — talks to GoPro |
+| ESP-01S / ESP8266 | 1 | ~$3 | Camera bridge — talks to GoPro; module envelope 24.7 × 14.3 × 12.0mm |
 | USB power bank (5000mAh+) | 1 | ~$10 | Powers both boards + GoPro |
 | Micro-USB cable (short) | 2 | ~$2 | Power bank → boards + GoPro |
 | Jumper wires F-F | 3 | ~$0.25 | UART TX/RX/GND between boards |
@@ -45,8 +45,8 @@ Each camera node is two ESP boards in a small case that clips to the tripod/stan
 **Pipeline:** `hardware/DESIGN_PIPELINE.md`
 
 Four exported prototype files:
-1. **Case body** — holds both boards stacked, cable ports, rear dovetail-style receiver
+1. **Case body** — holds both boards side-by-side with extra wiring/service clearance, cable ports, rear mounting boss
-2. **Case lid** — screw-on cover with ventilation
+2. **Case lid** — screw-on cover with ventilation and underside locating lip for flush seating
 3. **Tripod clamp** — separate screw-tightened C-clamp sized around a 35mm stand/pole
 4. **Full preview** — combined visualization STL only, not intended as the print job
 
@@ -105,8 +105,10 @@ The ESP8266 and GoPro talk over Wi-Fi — **no data cable between them**. The on
 
 | | W × D × H (mm) |
 |---|---|
-| Case body external | ~56.8 × 36.6 × 19.0 |
+| Board envelope basis | ESP32-C3 Super Mini: 22.5 × 18.0; ESP-01S: 24.7 × 14.3 × 12.0 |
-| Lid external | ~56.8 × 32.8 × 4.0 |
+| Internal CAD allowance | ~71.2 × 34.0 × 22.0; intentionally includes wiring gutters and vertical connector clearance |
+| Case body external | ~76.0 × 42.6 × 26.0 including rear mount boss depth; main shell ~76.0 × 38.8 × 26.0 |
+| Lid external | ~76.0 × 38.8 × 3.6; includes 1.6mm underside locating lip |
 | Tripod clamp | ~43.0 × 53.5 × 16.0 |
 | Clamp-to-case mount | Two side-by-side M3 screws through flat mounting plate |
 | Clamp pole fit | Nominal 35mm; smaller poles TBD / may need inserts |

hardware/case/tripod-case-v3.scad

@@ -1,24 +1,31 @@
 // RemoteRig — Dual-ESP Tripod Case v3
-// v3d changes: screw-tightened tripod clamp + horizontal two-screw mount + flush locating-lip lid.
+// v3e changes: board-specific envelope for ESP32-C3 Super Mini + ESP-01S with wiring clearance.
 // Coordinate system: all case/lid geometry uses bottom-origin Z.
 
 $fn = 36;
 
-// Board dimensions
+// Board dimensions from selected modules.
-esp8266_w = 34.2; esp8266_d = 25.6; esp8266_h = 5;
+// ESP32-C3 Super Mini: 22.5 x 18.0 mm footprint.
-esp32_w   = 52;   esp32_d   = 28;   esp32_h   = 5;
+// ESP-01S / ESP8266:   24.7 x 14.3 x 12.0 mm envelope.
-board_gap = 3;
+// The case is intentionally larger than board footprints because the field
-stack_h   = esp8266_h + esp32_h + board_gap;
+// build needs room for Dupont/UART wiring, power leads, bend radius, and fingers.
-inner_w   = max(esp8266_w, esp32_w);
+esp32c3_w = 22.5; esp32c3_d = 18.0; esp32c3_h = 6.0;   // height allowance includes headers/pins TBD
-inner_d   = max(esp8266_d, esp32_d);
+esp01s_w  = 24.7; esp01s_d  = 14.3; esp01s_h  = 12.0;
-inner_h   = stack_h + 2;
+board_gap = 8.0;     // side-by-side service gap between boards
+wire_x    = 8.0;     // wiring gutter at left/right ends
+wire_y    = 8.0;     // wiring gutter along front/back edges
+wire_z    = 10.0;    // vertical wiring/connector clearance above tallest module
+
+inner_w   = esp32c3_w + esp01s_w + board_gap + wire_x*2;
+inner_d   = max(esp32c3_d, esp01s_d) + wire_y*2;
+inner_h   = max(esp32c3_h, esp01s_h) + wire_z;
 
 // Case parameters
 wall     = 2.0;
 tol      = 0.4;
-outer_w  = inner_w + wall*2 + tol*2;      // 56.8mm
+outer_w  = inner_w + wall*2 + tol*2;      // 76.0mm with current board/wiring envelope
-outer_d  = inner_d + wall*2 + tol*2;      // 32.8mm
+outer_d  = inner_d + wall*2 + tol*2;      // 38.8mm with current board/wiring envelope
-outer_h  = inner_h + wall*2;              // 19mm
+outer_h  = inner_h + wall*2;              // 26.0mm with current board/wiring envelope
 corner_r = 2.5;
 
 // Lid fit parameters